We are seeking an experienced Semiconductor Manufacturing Technician to join our advanced production facility in Geelong. In this role, you will take ownership of critical back-end assembly and silicon wafer-processing operations. You will be directly responsible for transforming silicon wafers into functional, separated die through precision grinding, dicing, laser segmenting, and advanced bonding processes.
Key Responsibilities
- Wafer Processing: Execute precise silicon wafer thinning, back grinding and dicing protocols to meet strict thickness and dimensional tolerances.
- Equipment Maintenance: Operate, setup, calibrate, and perform routine preventative maintenance on specialized DISCO grinding and dicing equipment.
- Advanced Singulation: Run and optimize laser segmenting processes for complex wafer designs to ensure clean die separation.
- Die & Wire Bonding: Set up, program, and operate automated die bonding and wire bonding machinery to securely connect microchips to substrates.
- Quality Assurance: Utilize microscopes and automated optical inspection (AOI) tools to identify defects, minimize chipping, and maintain high yield rates.
- On-Site Operations: Maintain strict cleanroom protocols, safety standards, and log comprehensive production data.
Required Qualifications & Experience
- Experience: Minimum of 4+ years of hands-on experience in a semiconductor manufacturing or high-tech electronics assembly environment.
- Silicon Wafer Mastery: Strong working knowledge of silicon wafer handling, properties, and back-end structural processing.
- Tooling Expertise: Demonstrated proficiency in operating and maintaining DISCO dicing saws or grinders (e.g., blade changes, alignment calibrations, troubleshooting).
- Technical Skills: Confirmed experience with laser segmenting, wire bonding, and die bonding machinery.
- Precision & Detail: High manual dexterity and comfort working with microscopic components under magnification.
- Education: Certificate, Diploma, or Trade Qualification in Electronics, Mechanical Engineering, Materials Science, or a related technical discipline is highly regarded.
Pay: $35.00 per hour
Work Location: In person
